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It’s time for something better, faster, and simpler
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Maecenas lorem eu malesuada fermentum duis. Mauris quam consequat ridiculus si nunc ut.
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To build the semiconductor assembly, test, and packaging capability India's electronics industry doesn't yet have at home, to a standard that lets Triveni stand alongside the global players it will eventually work alongside.
A semiconductor assembly, test, and packaging facility in India, targeting operational readiness in March 2027, engineered from day one to the standards global partners require.
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